Copper Circle
Overview
Copper Circle is a circular electrode substrate made of high-purity copper (typically ≥99.9%). Its core advantages are excellent electrical conductivity, high thermal conductivity (approximately 400 W/(m·K)), and good machinability, enabling efficient current transmission, electrochemical reactions, and signal detection. Copper Circle is commonly used in electroplating, electrochemical processing, electronic components, resistance welding, mold manufacturing, and other fields. Essentially, it serves as a core conductive carrier connecting electrical energy with specific functional requirements such as industrial production, energy storage, and electronics manufacturing.
Copper Advantages
- Exceptional electrical conductivity ensures high current transmission efficiency and rapid heat dissipation, preventing electrode deformation or damage from overheating while reducing reliance on cooling systems.
- Excellent chemical stability resists oxidation at ambient temperatures, demonstrating outstanding stability particularly in neutral or weakly alkaline environments, thereby extending service life.
- Excellent thermal conductivity with a stable coefficient of thermal expansion, preventing electrode failure due to localised melting.
- Superior weldability, delivering high joint strength and electrical conductivity without requiring specialised welding techniques.
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Copper readily undergoes cold rolling, stamping, and precision machining, enabling the production of high-precision electrode discs with smooth surfaces that meet the demands of microelectronics and precision electrochemical applications.
Application
1. Electrochemical Applications
Copper Circles serve as anodes in electrolytic cells, facilitating metal deposition during electroplating processes.
They are employed in electrochemical analysis to investigate metal ion behaviour and reaction kinetics.
2. Electronic Component Manufacturing
Commonly employed in producing electronic components such as integrated circuits (ICs), resistors, and inductors;
Copper Electrodes serve as conductors or contact points to enhance circuit performance.
3. Resistance Welding Processes
Used for copper foil spot welding and precision component joining of electronic hardware, terminals, and connectors;
Suitable for high-conductivity welding applications like lamp holders and switch copper plates.
4. Mould Machining (EDM)
Provides stable current pathways for high-precision machining of complex cavities.
5. Fuel Cells and Thermal Management
Serves as electrode material in fuel cells, contributing to enhanced cell efficiency;
Fabricates heat sinks, heat pipes, and other thermal conduction components for electronic devices and heat exchange systems.
Copper Circle Dimension
|
Material |
Cu |
|
Purity |
99.95% |
|
Diameter |
5-50mm |
|
Thickness |
0.5-3mm |
|
Conductivity |
58×10⁶ S/m |
|
Density |
8.9g/cm3 |
|
Melting Point |
1083 °C |
|
Surface |
Polished, Alkali Wash |
|
Delivery Time |
25 days |
|
Standard |
ASTM, GB, ANSI |
|
Certification |
ISO9001 |
Process
① High-purity copper powder is selected to ensure that the electrical conductivity, thermal conductivity, and mechanical strength meet the customer's customized requirements.
② Wire cutting, electrical discharge machining, or laser cutting are used to process the copper into the desired disc shape and size. (CNC machines are used for high-precision peripheral dimensions and hole positioning.)
③ Grinding and polishing are performed to remove surface oxides and impurities, improving surface finish. Electropolishing or chemical cleaning is optional to further enhance surface quality.
④ For special requirements, nickel plating, silver plating, or other coatings can be applied to enhance corrosion resistance and electrical conductivity.
⑤ Rigorous quality inspection is performed to check dimensional tolerances, surface roughness, electrical conductivity, and the presence of defects (such as pores and cracks). Qualified products are treated with an anti-oxidation agent and vacuum-packed.
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